BCM IN440EX-D Download Treibers, Manuell und BIOS
Verfügbare 9 dateien für IN440EX-D
Firma
BCM
Komponente
Motherboard
Modell
BCM IN440EX-D
Beschreibung
BIOS Updates
Version BIOS
1.01
Größe
155Kb
Dateiname
in440ex-d-101.zip
Beschreibung
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Firma
BCM
Komponente
Motherboard
Modell
BCM IN440EX-D
Beschreibung
BIOS Updates
Version BIOS
1.00
Größe
154Kb
Dateiname
in440ex-d-100.zip
Beschreibung
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Firma
BCM
Komponente
Motherboard
Modell
BCM IN440EX-D
Beschreibung
BIOS Updates
Version BIOS
.02
Größe
155Kb
Dateiname
in440ex-d-102.zip
Beschreibung
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Firma
BCM
Komponente
Motherboard
Modell
BCM IN440EX-D
Beschreibung
Manual
Betriebssystem
Manual
Größe
539Kb
Dateiname
in440ex-d-man.pdf
Beschreibung
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Firma
BCM
Komponente
Motherboard
Modell
BCM IN440EX-D
Beschreibung
Intel INF Update Installer
Betriebssystem
Windows
Version Driver
2.30.021b
Größe
1.3Mb
Dateiname
infinst_enu.zip
Beschreibung
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Firma
BCM
Komponente
Motherboard
Modell
BCM IN440EX-D
Beschreibung
ATI Rage Pro Driver
Betriebssystem
Windows 95-98-98Se
Version Driver
5.20
Größe
2Mb
Dateiname
ati-520w95-98.zip
Beschreibung
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Firma
BCM
Komponente
Motherboard
Modell
BCM IN440EX-D
Beschreibung
ESS Solo 1 Driver
Betriebssystem
Windows 95-98-98Se
Version Driver
4.05.00.1087
Größe
200Kb
Dateiname
solo-1087w95-98.zip
Beschreibung
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Firma
BCM
Komponente
Motherboard
Modell
BCM IN440EX-D
Beschreibung
Intel PIIX Driver
Betriebssystem
Windows 95-NT4.0
Größe
897Kb
Dateiname
piix4.zip
Beschreibung
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Firma
BCM
Komponente
Motherboard
Modell
BCM IN440EX-D
Beschreibung
ESS Solo 1 Driver
Betriebssystem
Windows NT4.0
Version Driver
4.05.06
Größe
112Kb
Dateiname
solo40506-nt.zip
Beschreibung
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
