BCM IN440EX-D Télécharger Pilotes, Manuel et BIOS
Disponibles 9 fichiers pour IN440EX-D
Constructeur
BCM
Catégorie
Cartes mères
Modèle
BCM IN440EX-D
Description
BIOS Updates
Version BIOS
1.01
Taille
155Kb
Nom de fichier
in440ex-d-101.zip
Informations
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Constructeur
BCM
Catégorie
Cartes mères
Modèle
BCM IN440EX-D
Description
BIOS Updates
Version BIOS
1.00
Taille
154Kb
Nom de fichier
in440ex-d-100.zip
Informations
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Constructeur
BCM
Catégorie
Cartes mères
Modèle
BCM IN440EX-D
Description
BIOS Updates
Version BIOS
.02
Taille
155Kb
Nom de fichier
in440ex-d-102.zip
Informations
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Constructeur
BCM
Catégorie
Cartes mères
Modèle
BCM IN440EX-D
Description
Manual
Système d'exploitation
Manual
Taille
539Kb
Nom de fichier
in440ex-d-man.pdf
Informations
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Constructeur
BCM
Catégorie
Cartes mères
Modèle
BCM IN440EX-D
Description
Intel INF Update Installer
Système d'exploitation
Windows
Version Driver
2.30.021b
Taille
1.3Mb
Nom de fichier
infinst_enu.zip
Informations
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Constructeur
BCM
Catégorie
Cartes mères
Modèle
BCM IN440EX-D
Description
ATI Rage Pro Driver
Système d'exploitation
Windows 95-98-98Se
Version Driver
5.20
Taille
2Mb
Nom de fichier
ati-520w95-98.zip
Informations
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Constructeur
BCM
Catégorie
Cartes mères
Modèle
BCM IN440EX-D
Description
ESS Solo 1 Driver
Système d'exploitation
Windows 95-98-98Se
Version Driver
4.05.00.1087
Taille
200Kb
Nom de fichier
solo-1087w95-98.zip
Informations
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Constructeur
BCM
Catégorie
Cartes mères
Modèle
BCM IN440EX-D
Description
Intel PIIX Driver
Système d'exploitation
Windows 95-NT4.0
Taille
897Kb
Nom de fichier
piix4.zip
Informations
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Constructeur
BCM
Catégorie
Cartes mères
Modèle
BCM IN440EX-D
Description
ESS Solo 1 Driver
Système d'exploitation
Windows NT4.0
Version Driver
4.05.06
Taille
112Kb
Nom de fichier
solo40506-nt.zip
Informations
CONTENTS
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
Rights: ................................................Error! Bookmark not defined.
Responsibility: .................................................................................. 2
ISO 9001 Certificate: ........................................................................ 3
CE Declaration: ................................................................................ 3
FCC Compliance: ............................................................................. 3
Microsoft Windows Compliance:....................................................... 3
FEATURES............................................................................11
Photo of the motherboard ................................................................11
FEATURES.....................................................................................12
1. INTRODUCTION...........................................................15
1.1. Overview ...............................................................................15
1.1.1. Processor Subsystem ..........................................................15
1.1.2. Cache Subsystem ................................................................16
1.1.3. Memory Subsystem .............................................................16
1.1.4. Data Integrity Subsystem .....................................................17
1.1.5. A.G.P. Interface ...................................................................17
1.1.6. Embedded PCI Devices........................................................18
1.1.7. PCI Bus Master IDE .............................................................18
1.1.8. PCI Add-in Cards .................................................................18
1.1.9. Embedded A.G.P. Devices ...................................................18
1.1.10. Embedded I/O Subsystem....................................................18
1.1.11. System Management Subsystem .........................................19
1.1.12. Advanced Configuration and Power Interface “ACPI” ............19
2. FUNCTIONAL ARCHITECTURE...................................21
2.1. Processor Subsystem ............................................................21
2.1.1. SLOT-1 Processor Socket Pinout .........................................21
2.1.2. Processor Upgrade ..............................................................21
2.1.3. Processor Heat Sink.............................................................21
2.2. Memory Subsystem ...............................................................21
2.2.1. DRAM Subsystem................................................................21
2.2.2. DRAM (DIMM) Sockets ........................................................22
2.2.3. System BIOS .......................................................................22
2.3. L2 Cache Subsystem.............................................................22
2.3.1. Cacheable and Non-Cacheable Regions...............................23
